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Diffusion Barriers for Copper Metallization: Predicting Phase Stability and Reactivity using Equilibrium Thermodynamics

Published online by Cambridge University Press:  10 February 2011

C. E. Ramberg,
E. Blanquet,
M. Pons,
V. Ghetta,
C. Bernard and
R. Madar
C. E. Ramberg
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
E. Blanquet
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
M. Pons
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
V. Ghetta
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
C. Bernard
Affiliation:
LTPCM-ENSEEG - BP 75 - 38402 St. Martin d'Hères, (France)
R. Madar
Affiliation:
LMGP-ENSPG - BP 46 - 38402 St. Martin d'Hères, (France)
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Abstract

The guidelines for designing a conductive, amorphous material, capable of thermodynamic equilibrium with copper, are defined using readily available thermodynamic information. The tradeoff between desired properties – equilibrium at the interfaces, amorphous microstructure, and electronic conductivity – are described, along with trends in relevant binary systems that result in these properties. These guidelines defined systems for experimental study, for which preliminary results are presented.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 564: Symposium N – Advanced Interconnects and Contacts , 1999, 299
Copyright
Copyright © Materials Research Society 1999

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