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Efficient Interfacial Design - A Multidisciplinary View

Published online by Cambridge University Press:  10 February 2011

C. F Shih,
W. T. Chen,
B. Cotterell,
S. K. Lahiri and
Y.W. Zhang
C. F Shih
Affiliation:
Institute of Materials Research and Engineering, Singapore 119260
W. T. Chen
Affiliation:
Institute of Materials Research and Engineering, Singapore 119260
B. Cotterell
Affiliation:
Institute of Materials Research and Engineering, Singapore 119260
S. K. Lahiri
Affiliation:
Institute of Materials Research and Engineering, Singapore 119260
Y.W. Zhang
Affiliation:
Institute of Materials Research and Engineering, Singapore 119260
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Abstract

One of the most important mechanical features in microelectronic packaging is the nterface. Recent developments in modelling interfacial fracture and the easurement of interfacial toughness relevant to microelectronic packaging are discussed.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998, 3
Copyright
Copyright © Materials Research Society 1998

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References

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