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Electrical and Optical Interconnection-Technology based on Ormocer® - Inorganic-Organic Hybrid Materials

Published online by Cambridge University Press:  01 February 2011

Michael Popall*
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, GERMANY
Ralf Buestrich
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, GERMANY
Frank Kahlenberg
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D-97082 Würzburg, GERMANY
Annika Andersson
Affiliation:
ACREO AB, Bredgatan 34, SE-602 21 Norrköping, SWEDEN
Joacim Haglund
Affiliation:
ACREO AB, Bredgatan 34, SE-602 21 Norrköping, SWEDEN
Mats E. Robertsson
Affiliation:
ACREO AB, Bredgatan 34, SE-602 21 Norrköping, SWEDENEricsson Components AB, S-164 81 Kista-Stockholm, SWEDEN
Gerd Blau
Affiliation:
CSEM, PO: Box, CH-8048 Zürich, SWITZERLAND
Mike Gale
Affiliation:
CSEM, PO: Box, CH-8048 Zürich, SWITZERLAND
Oliver Rösch
Affiliation:
Robert Bosch GmbH, FV/FLD, P.O. Box, D-70049 Stuttgart, GERMANY
Alexander Dabek
Affiliation:
Technische Universität Berlin, Gustav-Meier-Allee 25, D-13355 Berlin, GERMANY
Jens Neumann-Rodekirch
Affiliation:
W.C. Heraeus, Thickfilm, Heraeusstr. 12–14, D-63450 Hanau, GERMANY
Lubomir Cergel
Affiliation:
Motorola SPS, 207 Route de Ferney, P.O. Box 15, 1218 Geneva, SWITZERLAND
Daniel Lambert
Affiliation:
BULL, VLSI Packaging, Rue Jean-Jaures - BP 68, F-78340 Les Clayes-sous-Bois, FRANCE
*
* Author to whom correspondence should be addressed.
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Abstract

Photopatternable hybrid inorganic-organic polymers with negative resist behaviour have been developed and tested for evaluation in optical and electrical interconnection technology. They are composed of inorganic oxidic structures cross-linked or substituted by organic groups. The synthesis starts from organosilane precursors reacted by sol-gel-processing in combination with organic crosslinking of polymerisable organic functions. As a result of these functionalities the properties of the ORMOCER®s are adjusted to the particular applications. Systematic variation of composition combined with adaptation to micro system technology allows great flexibility in processing. The main features of these materials are:

• Combined use as dielectric and passivation layers in electrical systems and devices as well as core and cladding for optical applications enables e/o applications with high integration levels.

• Postbaking at moderate temperatures (120 - 170 °C) enables processing on low-cost substrates such as FR-4 (a glass-fibre reinforced epoxy-polymer).

• Easily adaptable to thin film technology: spin-on with planarisation > 90 %, via diameters down to 20 μm and high aspect ratio for optical waveguides have been achieved.

Synthesis, modification of the resins towards technological needs, their thin film technology and the resulting demonstrators will be discussed.

Information

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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