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Experimental Investigation on Interfacial Adhesion in Microelectronic Assemblies

Published online by Cambridge University Press:  10 February 2011

Xiang Dai,
Mark V. Brillhart and
Paul S. Ho
Xiang Dai
Affiliation:
University of Texas, Lab for Interconnect and Packaging, PRC/MER, MC R8650, Austin, Texas 78712
Mark V. Brillhart
Affiliation:
Hewlett-Packard Co., Electronic Assembly Development Center, 1501 Page Mill Road, MS 5L-3, Palo Alto, CA 94304
Paul S. Ho
Affiliation:
University of Texas, Lab for Interconnect and Packaging, PRC/MER, MC R8650, Austin, Texas 78712
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Abstract

In this paper, we report recent studies on interface adhesion in flip-chip packaging. The adhesion energies of underfill interfaces found in typical flip-chip packaging pplications are characterized and presented using a racture-mechanics approach. The effects of underfill formulations and changes in polymer top-layer on PCB and chip passivation are also evaluated. The effects of underfill organosilane content, ubstrate surface chemistry and morphology, and underfill filler content are discussed in terms of fundamental mechanisms of adhesion.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998, 15
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1.The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, San Jose, CA. (1997).Google Scholar
2. Suryanarayana, D., Hsiao, R., Gall, T. P., and McCreary, J. M., “Flip-Chip Solder Bump Fatigue Enhancement by Polymer Encapsulation,” IEEE Trans. of Components & Hybrid and Manufacturing Technology, Vol.16, No. 8, p. 858, 1993.Google Scholar
3. Wu, T. Y., Tsukada, Y., and Chen, W. T., “Materials and Mechanics Issues in Flip-Chip Organic Packaging,” Proc. 46th Electronic Components and Technology Conference, pp. 524–534, May, 1996.Google Scholar
4. Huchinson, J. W., and Suo, Z., “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29, pp. 63–191, 1992.Google Scholar
5. Dai, X., Brillhart, M. V., and Ho, P. S., “Investigation of Underfill Adhesion in Plastic Flip-Chip Packages,” Proc. 1997 ASME International Mechanical Engineering Congress and Exposition, AMD-Vol. 222/EEP-Vol. 20, Application of Fracture Mechanics in Microelectronic Packaging, pp. 115–124.Google Scholar
6. Kinloch, A. J., “Fracture Mechanics of Adhesive Joints,” Adhesion and Adhesives: SCIENCE AND TECHNOLOGY, Chapter 7, CHAPMAN & HALL, London, 1990.Google Scholar
7. Hashemi, S., Kinloch, A. J, and Williams, J. G., “The analysis of interlaminar fracture in uniaxial fiber-polymer composites”, Proc. R. Soc. Lond., A 427, pp. 173–199, 1990.Google Scholar
8. Blackman, B. R. K., Dear, J. P., Kinloch, A. J, Macgillivaray, H., Wang, Y., Williams, J. G., and Yayla, P., “The failure of fiber composites and adhesively bonded fiber composites under high rates of test. Part 1: Mode 1 loading - experimental studies”, Journal of Materials Science, 30, pp. 5885–5900, 1995.Google Scholar