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FTIR and XPS Studies of Polyimide/Metal Interface Formation

Published online by Cambridge University Press:  21 February 2011

William C. Stewart,
Jihperng Leu and
Klavs F. Jensen
William C. Stewart
Affiliation:
United States Air Force, FTD/TQTRE, Wright Patterson AFB, OH 45433–6508
Jihperng Leu
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
Klavs F. Jensen
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, Minneapolis, MN 55455
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Abstract

We describe infrared and x-ray photoelectron spectroscopy studies of the interfaces formed when the PMDA/ODA polyamic acid is imidized on gold, chromium, and copper. Polyimide films ranging from 34 Å to 1328 Å are analyzed as part of these studies. The IR and XPS results indicate that the gold interacts very little with the polyimide, while copper produces significant changes in the IR and XPS spectra. At elevated cure temperatures passivated chromium also reacts with the polyimide. In structures with chromium and copper, the thermal stability of the polyimide at the interface is reduced from that of bulk polyimide. The data demonstrate that the metals interact with the polymer structure at the point where ring closure occurs to form the polyimide from polyarnic acid.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989, 329
Copyright
Copyright © Materials Research Society 1989

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