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Grain Boundary Transformations in Bi-Doped Copper

Published online by Cambridge University Press:  25 February 2011

Elsie C. Urdaneta
Affiliation:
University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, PA 19104
David E. Luzzi
Affiliation:
University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, PA 19104
Charles J. McMahon Jr
Affiliation:
University of Pennsylvania, Department of Materials Science and Engineering, Philadelphia, PA 19104
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Abstract

Bismuth-induced grain boundary faceting in Cu-12 at ppm Bi polycrystals was studied using transmission electron microscopy (TEM). The population of faceted grain boundaries in samples aged at 600°C was observed to increase with heat treatment time from 15min to 24h; aging for 72h resulted in de-faceting, presumably due to loss of Bi from the specimen. The majority of completely faceted boundaries were found between grains with misorientation Σ=3. About 65% of the facets of these boundaries were found to lie parallel to crystal plane pairs of the type {111}1/{111]2- The significance of these findings in light of recent high resolution electron microscopy experiments is discussed.

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