Hostname: page-component-7b7567c8c-tnzcf Total loading time: 0 Render date: 2026-11-13T22:50:06.284Z Has data issue: false hasContentIssue false
  • English
  • Français

High Frequency, High Density Interconnect Using AC Coupling

Published online by Cambridge University Press:  01 February 2011

Paul Franzon,
Angus Kingon,
Stephen Mick,
John Wilson,
Lei Luo,
Karthik Chandrasakhar,
Jian Xu,
Salvatore Bonafede,
Alan Huffman and
Chad Statler
...Show all authors
Paul Franzon
Affiliation:
Department of Electrical and Computer Engineering
Angus Kingon
Affiliation:
Department of Electrical and Computer EngineeringDepartment of Materials Science and Engineering
Stephen Mick
Affiliation:
Department of Electrical and Computer Engineering
John Wilson
Affiliation:
Department of Electrical and Computer Engineering
Lei Luo
Affiliation:
Department of Electrical and Computer Engineering
Karthik Chandrasakhar
Affiliation:
Department of Electrical and Computer Engineering
Jian Xu
Affiliation:
Department of Electrical and Computer Engineering
Salvatore Bonafede*
Affiliation:
Department of Electrical and Computer Engineering
Alan Huffman*
Affiliation:
Department of Electrical and Computer Engineering
Chad Statler*
Affiliation:
Department of Electrical and Computer Engineering
Richard LaBennett*
Affiliation:
Department of Electrical and Computer Engineering
*
+ MCNC-RDI, Contact: Box 7914, NC State University, Raleigh NC 27695, paulf@ncsu.edu; 919.515.7351
+ MCNC-RDI, Contact: Box 7914, NC State University, Raleigh NC 27695, paulf@ncsu.edu; 919.515.7351
+ MCNC-RDI, Contact: Box 7914, NC State University, Raleigh NC 27695, paulf@ncsu.edu; 919.515.7351
+ MCNC-RDI, Contact: Box 7914, NC State University, Raleigh NC 27695, paulf@ncsu.edu; 919.515.7351
Get access

Abstract

AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 75 μm and signaling rates greater than 5 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches, status, and discusses material issues important to performance.

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

[1] Kühn, S. A., “Vertical Signal Transmission in Three-Dimensional Integrated Circuits by Capacitive Coupling”, 1995 IEEE International Symposium on Circuits and Systems. ISCAS '95, vol 1, 1995, pp 37–40.Google Scholar
[2] Salzman, D., Knight, T., “Capacitively Coupled MultiChip Modules,”, Proc. 1994 IEEE Multichip Module Conference, pp. 487–494.Google Scholar
[3] Kanda, K., Dwi Antono, D., Ishida, K., Kawaguchi, H., Kuroda, T., Sakurai, T., “1.27 Gbp/s/pin 3mW/pin Wireless Suporconnect Interface Scheme, ISSCC 2003, 10.7. Google Scholar
[4] Mick, S. E., Wilson, J. M., and Franzon, P., “4 Gbps AC Coupled Interconnection,” (invited paper), IEEE Custom Integrated Circuits Conference, May 12–16, 2002, pp. 133–140.Google Scholar
[5] Mick, S., Luo, L., Wilson, J., Franzon, P., “Buried solder bump connections for high-density capacitive coupling,” IEEE Electrical Performance of Electronic Packaging, 2002, pp. 205–208.Google Scholar
[6] Mick, S., Franzon, P., Huffman, A., “Packaging Technology for AC Coupled Interconnect,” in Proc. I4MAPS flip-chip Symposium, June 2000 Google Scholar