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High-Density, High-Thermal Dissipation Substrates Fabricated Using a Conductive Composite Material

Published online by Cambridge University Press:  10 February 2011

Lutz Brandt,
Goran Matijasevic,
Pradeep Gandhi and
Catherine Gallagher
Lutz Brandt
Affiliation:
Ormet Corporation, 2236 Rutherford Road, Suite 109, Carlsbad, CA 92008, ormet@pacbell.net
Goran Matijasevic
Affiliation:
Ormet Corporation, 2236 Rutherford Road, Suite 109, Carlsbad, CA 92008, ormet@pacbell.net
Pradeep Gandhi
Affiliation:
Ormet Corporation, 2236 Rutherford Road, Suite 109, Carlsbad, CA 92008, ormet@pacbell.net
Catherine Gallagher
Affiliation:
Ormet Corporation, 2236 Rutherford Road, Suite 109, Carlsbad, CA 92008, ormet@pacbell.net
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Abstract

Thermal performance of conventional printed circuit materials can be increased with the use of heat sinks. Even better thermal dissipation can be achieved with the use of insulated metal boards as substrates. However, this technology is limited in the number of circuit layers and the circuit density. A novel material based on transient liquid phase sintering (TLPS) was developed and used to make additive multilayer circuits on metal substrates. The partial sintering operation of the polymer-based conductive composite is akin to that of Cermet materials, but processing is at temperatures of < 250° C. A metallurgically alloyed web is formed by TLPS, providing good conductivity and stability with respect to humidity and heat exposure. An interpenetrating polymer network provides adhesion to a variety of substrates.

Photoimageable dielectrics have been used to image circuit traces (as fine as 50 μm) and vias (down to 75 μm). The conductive composite is filled into the grooves and cured to form circuits. Sequential building of circuit and via layers yields the desired planarized circuit with blind and buried solid vias throughout the multilayer structure. Metal substrates have been chosen to achieve high thermal dissipation. The thermal conductivity of the polymer-based conductive composite itself was measured to be 25 W/mK, comparable to that of solder materials. Thermally resistive adhesive interfaces have been minimized in the fabricating the structure, resulting in a high thermal dissipation, as well as high density substrate.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998, 131
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

1 Heller, P., “Applications of Metal Matrix Composite Materials in SEM-E Cores and Multi Chip Modules,” Proceedings of the National Electronic Packaging and Production Conference NEPCON West, March 1993, pp. 2026–2031.Google Scholar
2 Dieffenbacher, W. C., “Evaluating SMT for Harsh Environments,” Proc Surface Mount International, Sept. 1992, pp. 1167–1170.Google Scholar
3 Aday, J., Johnson, R. W., Evans, J. L., and Romanczuk, C., “Thick Film Silver Multilayers for Under-the-Hood Automotive Applications,” Proceedings of the International Symposium on Microelectronics ISHM, Nov. 1993 pp. 126–131.Google Scholar
4 Johnson, R. W., Thomas, E. L., Duren, R. M., Curington, D. W., and Lippincott, A. C., “Insulated Metal Substrates for the Fabrication of a Half-Bridge Power Hybrid,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol.14, pp. 886–893, 1991.Google Scholar
5 TM, Thermalclad, Thermal Management Substrate, Bergquist Company.Google Scholar
6 Sigliano, R. E., “Using BGA Packages,” Advanced Packaging, vol.3, pp. 36–39, March/April 1994.Google Scholar
7 Dinella, D., “An Insulated Metal Printed Wire Board,” The Western Electric Engineer, vol.9, pp. 24–29, July 1965.Google Scholar
8 Capote, M. A., Todd, M., Gandhi, P., Carr, C., Walters, W., and Viajar, H., “Multilayer Printed Circuits from Revolutionary Transient Liquid Phase Inks,” Proceedings NEPCON West, Anaheim, California, pp. 1709–1715, February 1993.Google Scholar
9 Keusseyan, R. L. and Dilday, J. L., “Electric Contact Phenomena in Conductive Adhesive Connections,” Proceedings Surface Mount International, San Jose, California, pp. 567–571, August 1993.Google Scholar
10 Gilleo, K., Polymer Thick Film, Van Nostrand Reinhold, New York, 1996.Google Scholar
11 Taylor, R. E., Groot, H., and Ferrier, J., TPRL Report 1584, “Thermophysical Properties of Conductive Ink.”Google Scholar
12 Maglic, K. D. and Taylor, R.E., “The Apparatus for Thermal Diffusivity Measurement by the Laser Pulse Method,” in Compendium of Thermophysical Property Measurement Methods, ed. by Maglic, K. D., Cezairliyan, A., and Peletsky, V. E., Plenum Press, New York, 1984, pp. 281–314.Google Scholar
13 Licari, J.J., Multichip Module Design. Fabrication. and Testing, McGraw Hill, 1995, p. 259 Google Scholar
14 Patent no. 5,716,663.Google Scholar
15 McDonald, J. and Albright, G., “Microthermal Imaging in the Infrared,” Electronic Cooling, vol.3, pp. 26–29, January 1997.Google Scholar
16 Patent pending.Google Scholar
17 Episensor is a product of Vatell Corporation.Google Scholar