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Interdiffusion Kinetics and Magnetic Properties of TA-Permalloy Multilayers

Published online by Cambridge University Press:  15 February 2011

I. Hashim,
H. A. Atwater,
K. T. Y. Kung and
R. M. Valletta
I. Hashim
Affiliation:
Thomas J. Watson Laboratory of Applied Physics, California Institute of Technology, Pasadena, CA 91125
H. A. Atwater
Affiliation:
Thomas J. Watson Laboratory of Applied Physics, California Institute of Technology, Pasadena, CA 91125
K. T. Y. Kung
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
R. M. Valletta
Affiliation:
IBM Almaden Research Center, San Jose, CA 95120
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Abstract

The interdiffusion kinetics of ultrahigh vacuum deposited Ta/Ni81Fe19 short-period multilayers films have been investigated, and changes in microstructure were related to magnetic properties. Small angle X-ray diffraction and transmission electron microscopy were used to study layer morphology evolution and interdiffusion during post-growth isothermal annealing in the temperature range 300 – 600°C. The kinetic analysis suggests that interface roughening due to grain growth, and grain-boundary mediated diffusion of Ta occurs concurrently at early anneal times in the Ni81Fe19 films. Subsequent grainboundary and lattice diffusion of Ta lead to a reduction of magnetization and increase in coercivity of Ni81Fe19.

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References

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