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Internal Stress Development In Spin Coated Polyimide Films

Published online by Cambridge University Press:  15 February 2011

Michael T. Pottiger and
John Coburn
Michael T. Pottiger
Affiliation:
Du Pont Electronics, P. O. Box 80336, Wilmington, DE 19880–0336
John Coburn
Affiliation:
Du Pont Electronics, P. O. Box 80336, Wilmington, DE 19880–0336
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Abstract

The effect of processing on the development of internal stresses in spin coated polyimide films was investigated. The internal stresses are a result of the coefficient of thermal expansion (CTE) mismatch between the polymer and the substrate. Birefringence and CTE were used to characterize the in-plane molecular orientation. In-plane orientation was shown to be sensitive to processing conditions. Increasing the spin speed results in higher in-plane orientation as observed by an increase in birefringence and a corresponding decrease in CTE. Heating rate during cure was observed to have a significant effect on in-plane orientation. Faster heating rates during cure resulted in a lower birefringence. The lower birefringence is attributed to relaxation effects that can occur during a rapid cure. The decrease in orientation was accompanied by an increase in internal stress.

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References

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