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Low Dielectric Constant Fluorocarbon Films

Published online by Cambridge University Press:  10 February 2011

K. K. S. Lau and
K. K. Gleason
K. K. S. Lau
Affiliation:
Chemical Engineering Department, MIT, Cambridge, MA 02139, klau@mit.edu, kkgleasn@mit.edu
K. K. Gleason
Affiliation:
Chemical Engineering Department, MIT, Cambridge, MA 02139, klau@mit.edu, kkgleasn@mit.edu
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Introduction

Chemical vapor deposition (CVD) continues to generate immutable interest as a method of producing thin fluorocarbon films. This impetus stems from both the process advantages of CVD and the extensive market potential for the resultant films. Fluorocarbon films find extremely diverse applications because of their unique electrical, chemical and surface properties. They are currently being evaluated, among other applications, as dielectric interconnects in microelectronic circuits1–3 and as passivation coatings in clinical devices.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 544: Symposium Y – Plasma Deposition and Treatment of Polymers , 1998, 209
Copyright
Copyright © Materials Research Society 1999

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