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Low Dielectric Constant Thermostable Polymers

Published online by Cambridge University Press:  15 February 2011

B. Sillion,
G. Rabilloud,
J. Garapon,
O. Gain and
J. Vallet
B. Sillion
Affiliation:
UMR 102 CNRS-IFP, BP 3, 69390 Vernaison, France
G. Rabilloud
Affiliation:
Institut Français du Pétrole, BP 3, 69390 Vernaison, France
J. Garapon
Affiliation:
UMR 102 CNRS-IFP, BP 3, 69390 Vernaison, France
O. Gain
Affiliation:
UMR 102 CNRS-IFP, BP 3, 69390 Vernaison, France
J. Vallet
Affiliation:
UMR 102 CNRS-IFP, BP 3, 69390 Vernaison, France
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Abstract

The dielectric properties of the heat-resistant heterocyclic polymers are governed by their chemical structure and the absence of unwanted dipoles. A polyphenylquinoxaline is taken as an example of the effect of the dipole symmetry. In the particular case of polyimides, it is obvious that the dehydrocyclization of the intermediate polyamic acid has to be completed to produce the lowest achievable permittivity. This is illustrated by the polycondensation in solution of the polyimides based on 4,4'-(9H-fluoren-9-ylidene)-bisbenzeneamine. In addition, the spatial conformation of the macromolecular chain can also play an important role. The chemistry of a polyimide prepared from 4,4'-(1,3-benzenedicarbonyl) bis(1,2-benzenedicarboxylic acid dianhydride) allows to discuss this topic. However, a dielectric constant of 2.7 seems to be the ultimate value achievable for dense films prepared with the most performing polymers. The introduction of homogeneously distributed micro-voids allows the preparation of dielectric films with a permittivity lower than 2.0. The modification of a polymer with tertiobutyl carbonate (t.BOC) groups is a promising approach because it offers a large processability window.

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