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MEMS on LSI by Adhesive Bonding and Wafer Level Packaging

Published online by Cambridge University Press:  09 August 2012

Masayoshi Esashi and
Shuji Tanaka
Masayoshi Esashi
Affiliation:
Tohoku University, 6-6-01 Aza-Aoba Aramaki, Aobaku, Sendai, 980-8579, Japan
Shuji Tanaka
Affiliation:
Tohoku University, 6-6-01 Aza-Aoba Aramaki, Aobaku, Sendai, 980-8579, Japan
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Abstract

Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO3 wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Keywords

microelectro-mechanical (MEMS)packagingmicroelectronics

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References

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