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MEMS-CMOS Integrated Tactile Sensor with Digital Signal Processing for Robot Application

Published online by Cambridge University Press:  03 October 2012

M. Makihata,
M. Muroyama,
S. Tanaka,
H. Yamada,
T. Nakayama,
U. Yamaguchi,
K. Mima,
Y. Nonomura,
M. Fujiyoshi and
M. Esashi
M. Makihata
Affiliation:
Tohoku University, JAPAN
M. Muroyama
Affiliation:
Tohoku University, JAPAN
S. Tanaka
Affiliation:
Tohoku University, JAPAN
H. Yamada
Affiliation:
Toyota Motor Corp., JAPAN
T. Nakayama
Affiliation:
Toyota Motor Corp., JAPAN
U. Yamaguchi
Affiliation:
Toyota Motor Corp., JAPAN
K. Mima
Affiliation:
Toyota Motor Corp., JAPAN
Y. Nonomura
Affiliation:
Toyota Central R&D Labs., Inc. JAPAN
M. Fujiyoshi
Affiliation:
Toyota Central R&D Labs., Inc. JAPAN
M. Esashi
Affiliation:
Tohoku University, JAPAN
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Abstract

An ultra-small tactile sensor with functions of signal processing and digital communication has been prototyped based on MEMS-CMOS integration technology. The designed analog-digital mixed signal ASIC allows many tactile sensors to connect each other on a common bus line, which drastically reduces the number of wire. The ASIC capacitively detects the deformation of a force sensor and sends digital data to the common bus line when the force exceeds a threshold. The digital data contain a physical ID of each sensor, 32-bit sensing data and 16-bit cyclic redundancy check (CRC) code. In this study, a novel wafer-level integration and packaging technology were developed, and a chip-size-packaged tactile sensor with a small footprint (2.5mm×2.5mm) and a low profile (0.27mm) was prototyped and tested. The sensor autonomously sends digital data like a tactile receptor of human.

Keywords

bondingpackagingsensor

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References

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