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Micro-Indentation and Micro-Scratch Tests on Sub-Micron Carbon Films

Published online by Cambridge University Press:  22 February 2011

T. W. Wu,
R. A. Burn,
M. M. Chen and
P. S. Alexopoulos
T. W. Wu
Affiliation:
IBM Research Division, Almnaden Research Center, San Jose, CA 95120
R. A. Burn
Affiliation:
IBM Research Division, Almnaden Research Center, San Jose, CA 95120
M. M. Chen
Affiliation:
IBM General Product Division, San Jose, CA 95139
P. S. Alexopoulos
Affiliation:
IBM Research Division, Almnaden Research Center, San Jose, CA 95120
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Abstract

Micro-indentation and micro-scratch techniques were used to characterize the hardness and the adhesion strength of 0.11 μm thick sputtered carbon f-ilms on Silicon substrates. Hardness depth profiles and critical loads were measured using a microindenter under indentation and scratch testing modes, respectively. The carbon film with 6 mtorr argon sputtering pressure shows better practical adhesion (or higher critical load) and slightly higher hardness. The indentation fracture phenomenon observed on the 30 mtorr film is closely related to its poor adhesion. The failure mechanism will also be discussed.

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References

1. Karnowsky, M.M. and Estill, W.B., Rev. Sci. Instrum. 35 (10), 1324 (1964).10.1063/1.1718736Google Scholar
2. Steinmann, P.A. and Hintermann, H.E., J. Vac. Sci. Technol. A3 6, 2394 (1985).10.1116/1.572845Google Scholar
3. Steinmann, P.A., Tardy, Y. and Hintermann, H.E., Thin Solid Film 154,333 (1987).10.1016/0040-6090(87)90377-4CrossRefGoogle Scholar
4. Perry, A.J., Thin Solid Films 78, 77 (1981); 1077, 167 (1983).10.1016/0040-6090(81)90419-3CrossRefGoogle Scholar
5. Wu, T.W., Hwang, C., Lo, J. and Alexopoulos, P.S., presented at the 1988 Int. Conf. of Metall. Coatings, San Diego, CA, to be published in Thin Solid Films; IBM Research Report, RJ 6195 (1988).Google Scholar
6. Berkovich, E.S., Fact. Lab., Moscow 16, 345 (1950); Industr. Diam. Rev. 11,129 (1951).Google Scholar
7. Tabor, D., The Hardness of Metals, (Clarendon Press, Oxford, 1951), p. 8.Google Scholar
8. Burnett, P.J. and Rickerby, D.S., Thin Solid Films 154, 403 (1987).10.1016/0040-6090(87)90382-8Google Scholar
9. Mittal, K.L., in Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings, edited by Mittal, K.L. (STP 640, ASTM, Philadelphia, PA 1978), p. 5.10.1520/STP38620SCrossRefGoogle Scholar
10. Ahn, J., Mittal, K.L. and MacQueen, R.H., in Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings, edited by Mittal, K.L. (STP 640, ASTM, Philadelphia, PA 1978), p. 134.10.1520/STP38630SCrossRefGoogle Scholar
11. Lim, G., Chen, M.M., Castillo, G. and Perera, R.C.C., presented at 37th Annual Dever Conf. on Applications of X-ray Analysis, Aug. 3, 1988, to be published in Advanced in X-Ray Analysis.Google Scholar