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Micromechanical Tensile Testing

Published online by Cambridge University Press:  15 February 2011

S. Greek,
F. Ericson,
S. Johansson and
J.-Å. Schweitz
S. Greek
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
F. Ericson
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
S. Johansson
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
J.-Å. Schweitz
Affiliation:
Materials Science, Uppsala University, Box 534, S-751 21 Uppsala, Sweden, Staffan.Greek@teknikunm.uu.se
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Abstract

A method is described where tensile tests can be performed in situ on micromachined structures. The testing equipment consists of a testing unit mounted on a micromanipulator in a Scanning Electron Microscope (SEM). The fracture loads of micromachined beam structures made from thick and thin film polysilicon as well as from electrodeposited nickel and nickeliron alloy were measured, and the fracture strengths then calculated via measurements of the test structures’ initial cross-sectional areas. The statistical scatter of the polysilicon fracture strength values were evaluated by Weibull statistics. The mean fracture strength and the Weibull modulus, a measure of the scatter, were obtained

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References

[1] Biebl, M. and von Philipsborn, H., Digest of Techn. Papers, The 8th Int. Conf. Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, June 25–29,.2 72 (1995).Google Scholar
[2] Scafidi, P., Ignat, M., Mortini, P., Marty, M. in An Analysis by Scanning Acoustic Microscopy of the Mechanical Stability of PSG and Si3N4 Passivation Films, (Mater. Res. Soc. Proc. 338, Pittsburgh, PA, 1994) pp. 115–120.Google Scholar
[3] Johansson, S., 1st IARP Workshop on Microrobotics and Systems, Karlsruhe, Germany, p. 72 (1993).Google Scholar
[4] Kirsten, M., Wenk, B., Ericson, F., Schweitz, J.-Å., Riethmüller, W. and Lange, P., Thin Solid Films, 259 181 (1995).Google Scholar
[5] Benitez, M.A., Esteve, J., Benrakkad, M.S., Morante, J.R., Samitier, J. and Schweitz, J.-Å, Digest of Techn. Papers, The 8th Int. Conf. Solid-State Sensors and Actuators, and Eurosensors IX, Stockholm, Sweden, June 25–29, 2 88 (1995).Google Scholar
[6] Gobet, J., Cardot, F., Bergqvist, J., Rudolf, F., J. Micromech. Microeng. 3 123 (1993).Google Scholar
[7] Weibull, W., J. Appl. Mech., 18 293 (1951).Google Scholar
[8] Ericson, F. and Schweitz, J.-[, J. Appl. Phys., 68 5840 (1990).Google Scholar
[9] Safranek, William H., in The Properties of Electrodeposited Metals an Alloys (American Elsevier Publishing Co, New York, 1974) pp. 241–258.Google Scholar
[10] Safranek, William H., in The Properties of Electrodeposited Metals an Alloys (American Elsevier Publishing Co, New York, 1974) pp. 304–305.Google Scholar