Hostname: page-component-6898cfcb55-zkb6p Total loading time: 0 Render date: 2026-11-11T13:06:11.009Z Has data issue: false hasContentIssue false
  • English
  • Français

Micromechanical Thin-Film Characterization

Published online by Cambridge University Press:  10 February 2011

M. Scherge,
O. Mollenhauer,
F. Spiller and
J. A. Schaefer
M. Scherge
Affiliation:
Technische Universität Ilmenau, Institut f. Physik, D-98684 Ilmenau, GERMANY
O. Mollenhauer
Affiliation:
TETRA GmbH Ilmenau, Am Wald 4, D-98693 Ilmenau, GERMANY
F. Spiller
Affiliation:
IMMS gGMBH Ilmenau, Langewiesener Str. 22, D-98693 Ilmenau, GERMANY
J. A. Schaefer
Affiliation:
Technische Universität Ilmenau, Institut f. Physik, D-98684 Ilmenau, GERMANY
Get access

Abstract

Microelectromechanical systems (MEMS) can be regarded as advanced film-based devices. Although the dimensions of a MEMS are in the range of micrometers to millimeters, due to low mass and contact area the interaction of the micro parts is confined to the upper monolayers of the material. To achieve a good performance as well as a long lifetime it is necessary to control the adsorbate coverage of the micro parts. Besides the tools of surface science (XPS, HREELS, AES, … ) a precise characterization of the adsorbate film with respect to mechanical properties (adhesion, friction, mechanically induced desorption) is required. Those needs are met with a new generation of test equipment comprising of sensors and actuators, thus, rendering the instruments also a MEMS. Force sensing devices made of glass are introduced to measure ultra low deflections caused by the interaction of the micro parts via the adsorbate layer. The devices combine precisely etched glass structures (bending beams,) with fiber optics.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 569: Symposium U – In Situ Process Diagnostics and Modelling , 1999, 139
Copyright
Copyright © Materials Research Society 1999

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

[1] Scherge, M., Li, X. and Schaefer, J. A., to appear in: Tribology Letters, 1999 Google Scholar
[2] Romanowicz, B., Lerch, Ph., Renaud, Ph., Vachoux, A., Workshop on Libraries, Component Modeling, and Quality Assurance, IRESTE-IHT, Nantes, France (26-27.04.1995), 167–177.Google Scholar
[3] Fujisawa, S., Kishi, E., Sugawara, Y., Morita, S., Jpn. J. Appl. Phys., 33(1994), 3752–3755.10.1143/JJAP.33.3752Google Scholar
[4] Binggeli, M., Mate, C. M., J. Vac. Sci. Technol. B, 13(1995)3, 1312–1315.10.1116/1.587844Google Scholar
[5] Bhushan, B., Koinkar, V. N., Wear, 180(1995), 9–16.10.1016/0043-1648(94)06534-9Google Scholar
[6] Scherge, M., Schaefer, J. A., Tribology Letters, 4(1998)1, 37–42.10.1023/A:1019182500536Google Scholar
[7] Scherge, M., Büchner, H., Jäger, G., Schaefer, J. A., Journal of Optics, 29(1998), 1–5.10.1088/0150-536X/29/1/004Google Scholar
[8] Scherge, M., Schaefer, J. A., in: Tribology Issues and Opportunities in MEMS, Surface Modification and Mechanical Properties of Bulk Silicon, Kluwer Academic Publishers, 1998, 529–538 10.1007/978-94-011-5050-7_39Google Scholar