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Mixed Mode Fracture in Electronic Packages

Published online by Cambridge University Press:  10 February 2011

W. O. Soboyejo,
V. Sinha and
V. Kenner
W. O. Soboyejo
Affiliation:
Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210
V. Sinha
Affiliation:
Department of Materials Science and Engineering, The Ohio State University, Columbus, OH 43210
V. Kenner
Affiliation:
Department of Aeronautical Engineering, Applied Mechanics and Aviation, The Ohio State University, Columbus, OH 43210
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Abstract

In this paper, mixedmode (mode I + mode II) fracture toughness data are presented for the prediction of molding compound (silica filled epoxy resin) failure. The stresses necessary to cause the package cracking under mixed mode loading are experimentally determined. Measured toughness values are presented as a function of modemixity and temperature

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996, 263
Copyright
Copyright © Materials Research Society 1997

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