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Modified Preston Equation- Revisited

Published online by Cambridge University Press:  10 February 2011

S Ramarajan and
S.V. Babu
S Ramarajan
Affiliation:
Center for Advanced Materials Processing, Clarkson University, Potsdam, NY-13699.
S.V. Babu
Affiliation:
Center for Advanced Materials Processing, Clarkson University, Potsdam, NY-13699.
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Abstract

The effect of pressure and velocity on the polish rates of copper was determined in DI water and in the presence of ferric nitrate, H202/glycine, and NH4OH with alumina particles as the abrasives. The polish rate shows a stronger dependence on velocity than that predicted by the Preston equation in the case of ferric nitrate, a highly reactive chemical. The velocity dependence is weaker for the other two less reactive chemicals, and is the same as that predicted by Preston equation for DI water. Our earlier empirical model, R = KPV + BV + Rc, where K, B, and Rc are constants, describes all the polish rate data satisfactorily.

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References

REFERENCES

1. Tseng, Wei-Tsu., and Wang, Ying-Lang, Journal of Electrochemical Society, 1997, 144, p. L15. 10.1149/1.1837417Google Scholar
2. Zhang, F., and Busnaina, A., Electrochemical and Solid-State Letters, 1998, p. 184.10.1149/1.1390679Google Scholar
3. Preston, F., Journal of Society of Glass Technology, 1927, 11, p. 247. Google Scholar
4. Liu, C.W., Dai, B.T., Tseng, W.T., and Yeh, C.F, Journal of Electrochemical Society, 1996, 143, p.716 10.1149/1.1836507Google Scholar
5. Zhao, B., and F.G., Shi, Proc. 4 th international CMP-MIC, p13–22, Santa Clara, CA, Feb, 1999.`Google Scholar
6. Subramanian, R.S., Zhang, L., and Babu, S.V, Submitted to Journal of Electrochemical Society.Google Scholar
7. D.J., Stein, D.L., Hetherington, and Cecchi, J.L, Journal of Electrochemical Society, 1999, 146, p. 376.Google Scholar
8. Luo, Q., Ramarajan, S., and Babu, S.V, Thin Solid Films, 335, 1998, p. 160 10.1016/S0040-6090(98)00896-7Google Scholar
9. Wu, G., and Cook, L, Proc. 3 rd international CMP-MIC, p. 150, Santa Clara, CA, Feb, 1998.Google Scholar