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Mold Compounds: Linking Material Science and IC Package Reliability

Published online by Cambridge University Press:  21 February 2011

Steven K. Groothuis and
K. Gail Heinen
Steven K. Groothuis
Affiliation:
Texas Instruments, Inc., Semiconductor Packaging Laboratory P.O. Box 655012 M/S 477, Dallas, TX 75265
K. Gail Heinen
Affiliation:
Texas Instruments, Inc., Semiconductor Packaging Laboratory P.O. Box 655012 M/S 477, Dallas, TX 75265
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Abstract

Making the transition from mechanical testing of mold compounds to actual Integrated Circuit (IC) plastic package reliability requires an understanding of material behavior under the influences of moisture, temperature, and varying load conditions. This paper will focus on the role of material strengths, strain energy, and nonlinear effects in determining plastic package reliability. Examples of correlation between materials testing and reliability data will be presented.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995, 77
Copyright
Copyright © Materials Research Society 1995

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References

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