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Multilayer Composite Diamond Heat Spreaders for Electronic Packaging

Published online by Cambridge University Press:  10 February 2011

K. Jagannadham,
W. D. Fan,
R. B. Dinwidde and
J. Narayan
K. Jagannadham
Affiliation:
Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695–7916 Jag@mat.mte.ncsu.edu
W. D. Fan
Affiliation:
Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695–7916 Jag@mat.mte.ncsu.edu
R. B. Dinwidde
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831–6062
J. Narayan
Affiliation:
Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695–7916 Jag@mat.mte.ncsu.edu
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Abstract

Heat spreader characteristics of single layer and multilayer diamond composite substrates are determined by bonding to electronic device wafers. Preparation of diamond substrates, metallization and bonding procedures to device wafers are described. Infrared microscopy imaging of the bonded device wafers is used to determine the heat spreading characteristics. Advantages associated with multilayer diamond composite heat spreaders are discussed.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996, 51
Copyright
Copyright © Materials Research Society 1997

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References

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