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New Materials and New Processes for MEMS Applications

Published online by Cambridge University Press:  10 February 2011

J.-Å. Schweitz,
K. Larsson,
G. Thornell,
H. Björkman and
F. Nikolajeff
J.-Å. Schweitz
Affiliation:
Centre for Advanced Microengineering (AME), The Ångström Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden
K. Larsson
Affiliation:
Centre for Advanced Microengineering (AME), The Ångström Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden
G. Thornell
Affiliation:
Centre for Advanced Microengineering (AME), The Ångström Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden
H. Björkman
Affiliation:
Centre for Advanced Microengineering (AME), The Ångström Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden
F. Nikolajeff
Affiliation:
Centre for Advanced Microengineering (AME), The Ångström Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden
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Abstract

The field of “non-silicon MEMS” is today rapidly expanding. The reasons are numerous: silicon has a limited functionality in many MEMS applications; the toolbox for micromaching of non-silicon materials is steadily growing in size and versatility; the price level of a variety of other advanced materials for MEMS has become more competitive etc. This development is here illustrated by a number of examples from a wide variety of materials classes, methods for synthesis and microprocessing, and fields of application. Among these examples are high-aspect ratio processing of different materials by ion track technology (MITE) and deep ion projection lithography (DIPL); laser microprocessing and free-space 3D laser writing; high-precision 3D diamond replicas from microstructured silicon masters; and microreplication in polymeric materials for microoptics and microsystems technology.

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