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Optical Interconnect Components for Wafer Level HeterogeneousHyper-Integration

Published online by Cambridge University Press:  17 March 2011

P. D. Persans ,
M. Ojha ,
R. J. Gutmann ,
J.-Q. Lu ,
A. Filin  and
J. Plawsky
P. D. Persans
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
M. Ojha
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
R. J. Gutmann
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
J.-Q. Lu
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
A. Filin
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
J. Plawsky
Affiliation:
Focus Research Center: Interconnections for Gigascale Integration Rensselaer Polytechnic Institute, Troy, New York 12180, U.S.A
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Abstract

Optical waveguides for three-dimensionally stacked chip fabricationtechnologies, in which optical connection between layers plays a centralrole, are described. CMOS-compatible approaches to optical via and waveguidefabrication are addressed. Detailed modeling is used for design optimizationand also addresses how manufacturing variations from ideal design may affectdevice performance.

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References

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