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Parallel Down Flow Rinsl : Water Saving Technology in Wafer Rinse

Published online by Cambridge University Press:  10 February 2011

Y. Hiratsuka and
N. Fujikawa
Y. Hiratsuka
Affiliation:
Dan Science Co. Ltd. Ohwadacho 1‐9‐2, Hachiohji, Tokyo, 192, Japan.
N. Fujikawa
Affiliation:
Dan Science Co. Ltd. Ohwadacho 1‐9‐2, Hachiohji, Tokyo, 192, Japan.
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Abstract

We had proposed parallel downflow rinse which was capable of draining out chemical carried over to rinsing bath together with wafer about twice as fast as overflow rinse.In an attempt to further improve rinsing efficiency of PDR, we have investigated (1) the effect of wafer carrier shape, and (2) removal of boundary layer on wafer surface. Boat‐type wafer holder is preferable to conventional cassette. Three stirring techniques adequate for PDR, namely, megasonic irradiation. N2 bubbling, liquid level shifting, are found effective to remove chemical ion remaining boundary layer in measuring conductivity and resistivity.

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References

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