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Parylene Copolymers

Published online by Cambridge University Press:  15 February 2011

Kelly J. Taylor,
Mona Eissa,
Justin F. Gaynor,
Shin-Puu Jeng and
Hoan Nguyen
Kelly J. Taylor
Affiliation:
SPDC, Texas Instruments, Inc., P.O. Box 3701, Dallas, TX 75265
Mona Eissa
Affiliation:
SPDC, Texas Instruments, Inc., P.O. Box 3701, Dallas, TX 75265
Justin F. Gaynor
Affiliation:
SPDC, Texas Instruments, Inc., P.O. Box 3701, Dallas, TX 75265
Shin-Puu Jeng
Affiliation:
SPDC, Texas Instruments, Inc., P.O. Box 3701, Dallas, TX 75265
Hoan Nguyen
Affiliation:
SPDC, Texas Instruments, Inc., P.O. Box 3701, Dallas, TX 75265
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Abstract

Improvements in the properties of Parylene may enable their use in high performance integrated circuits. Parylenes are a class of polymers formed by chemical vapor deposition which nearly meet the high standards of the low-k triumvirate, namely, 1) adhesion, particularly to SiO2, 2) thermal stability above 400 Celsius, and 3) permittivity less than 2.7. Parylene-N has been incorporated into both aluminum-1 and copper-2 based metallization schemes, however, improvements in the adhesion and thermal stability are still needed to simplify and increase the robustness of the integration schemes. Additionally, a reduction in the permittivity would be beneficial from both device performance and extendibility points-of-view. We have synthesized various Parylene-N-based copolymers with improved adhesion, thermal stability, and permittivity. We discovered that a copolymer of tetravinyl-tetramethyl-cyclotetrasiloxane and Parylene-N has a permittivity of close to 2.1 and both the adhesion to SiQ2 and thermal stability are measurably improved compared to the homopolymer.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 476: Symposium N – Low-Dielectric Constant Materials III , 1997, 197
Copyright
Copyright © Materials Research Society 1997

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References

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