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Physical Characterization Of Microelectronic Polymeric Thin Films

Published online by Cambridge University Press:  15 February 2011

Stephen D. Senturia,
Susan C. Noe and
Jeffrey Y. Pan
Stephen D. Senturia
Affiliation:
Microsystems Technology Laboratories, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA
Susan C. Noe
Affiliation:
Microsystems Technology Laboratories, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA
Jeffrey Y. Pan
Affiliation:
Microsystems Technology Laboratories, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, 02139, USA
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Abstract

The measurement of the mechanical properties and adhesion of polymeric thin films and coatings poses a number of technical problems. Elastic and viscoelastic properties, residual stress, adhesion, the effects of extended cure, and the effects of adsorbed moisture and process reagents are all critical. A particular challenge is to develop measurement methods which can be used with actual samples, preferably non-destructively. This paper examines a number of methods which have been developed to make these measurements, with emphasis on methods which are sensitive enough to look at the effects of process variation and the effects of moisture exposure. Suspended-membrane methods for measuring elastic and viscoelastic properties, residual stress, and adhesion are combined with optical methods for determining index of refraction and birefringence to yield a family of techniques for performing physical characterization. Recent results on the effects of extended cure and moisture uptake on elastic properties, residual stress, and optical properties will be presented.

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