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Plasma Processing in Semiconductor Manufacturing

Published online by Cambridge University Press:  28 February 2011

Clarence J. Tracy
Clarence J. Tracy*
Affiliation:
Motorola, Process Technology Laboratory, Semiconductor Research and Development Laboratory, Phoenix, Az.85008
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Abstract

The implementation of plasma deposition and reactive ion etching into a semiconductor VLSI manufacturing process is rarely trivial.In some cases isolated process modules may appear to function well until integrated into a lengthy product flow, where interactions occur with prior or subsequent processing steps.In addition, dry processes have some unique and sometimes undesirable characteristics which need to be considered.Examples of both of these kinds of problems will be shown.Opportunities still exist for research to lead to a better understanding of mechanisms and for development work to improve the equipment and specific processes.

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Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 68: Symposium C – Plasma Processing , 1986, 35
Copyright
Copyright © Materials Research Society 1986

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