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Plastic Deformation in Thin Copper Films Determined by X-Ray Micro-Tensile Tests

Published online by Cambridge University Press:  15 February 2011

A. Kretschmann,
W.-M. Kuschke,
S. P. Baker and
E. Arzt
A. Kretschmann
Affiliation:
Max-Planck-Institut für Metal forschung, Seestr. 92, 70174 Stuttgart, Germany
W.-M. Kuschke
Affiliation:
Max-Planck-Institut für Metal forschung, Seestr. 92, 70174 Stuttgart, Germany
S. P. Baker
Affiliation:
Max-Planck-Institut für Metal forschung, Seestr. 92, 70174 Stuttgart, Germany
E. Arzt
Affiliation:
Max-Planck-Institut für Metal forschung, Seestr. 92, 70174 Stuttgart, Germany
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Abstract

Plastic deformation in thin copper films has been studied at room temperature. Copper films having a thickness of 1 μm were made by sputtering onto nickel substrates with a Si3N4 underlayer and with or without a Si3N4 caplayer. Deformation experiments were conducted using a special micro-tensile tester built into a θ–θ diffractometer. The problems normally associated with tension tests of free-standing films were avoided by deforming the substrate and film together. In-situ x-ray measurements of the lattice spacings and lattice spacing distributions were used to determine both elastic and plastic strains. The effects of caplayer and annealing temperature on mechanical properties are reported.

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