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Practical considerations in Megasonic Wafer Cleaning

Published online by Cambridge University Press:  10 February 2011

R. Mark Hall,
Taura Jarvis and
Thad Parry
R. Mark Hall
Affiliation:
SCP Global Technologies, 400 Benjamin Lane, Boise ID 83642, markhall@smtp.scpboi.com
Taura Jarvis
Affiliation:
SCP Global Technologies, 400 Benjamin Lane, Boise ID 83642, markhall@smtp.scpboi.com
Thad Parry
Affiliation:
SCP Global Technologies, 400 Benjamin Lane, Boise ID 83642, markhall@smtp.scpboi.com
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Abstract

In this study, critical hardware and process parameters are evaluated for their effect on performance in megasonic cleaning applications. Experimental data is presented which shows the impact of transducer design, bath temperature, process time, SC1 chemistry, and wafer gap spacing on particle removal and surface roughness. The ability to remove particles smaller than 0.1 um in size is also demonstrated.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 477 , 1997, 15
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

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