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Probing the Interfacial Adhesion Strength in Compositional Libraries of Epoxy Films

Published online by Cambridge University Press:  26 February 2011

Christopher M Stafford,
Jae Hyun Kim,
Daisuke Kawaguchi,
Gareth Royston and
Martin Y.M. Chiang
Christopher M Stafford
Affiliation:
chris.stafford@nist.gov, National Institute of Standards and Technology, NIST, 100 Bureau Dr., Gaithersburg, MD, 20899, United States
Jae Hyun Kim
Affiliation:
jae.kim@nist.gov, National Institute of Standards and Technology
Daisuke Kawaguchi
Affiliation:
daisuke@apchem.nagoya-u.ac.jp, Nagoya University
Gareth Royston
Affiliation:
g.royston@sheffield.ac.uk, University of Sheffield
Martin Y.M. Chiang
Affiliation:
martin.chiang@nist.gov, National Institute of Standards and Technology
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Abstract

We are developing a measurement platform, based on the edge delamination test geometry, geared towards combinatorial and high-throughput (C&HT) assessment of interfacial adhesion and reliability of epoxy films bonded to a rigid substrate. A critical parameter space to be explored is composition of the epoxy formulation. We have constructed an automated mixing and deposition system for creating discrete and continuous gradients in composition of viscous epoxy formulations. By dicing the combinatorial library into a contiguous discrete sample array, the interfacial adhesion strength can be deduced from the critical stress required to debond each film cell from the substrate. These results can be used to predict the adhesion reliability of epoxy formulations as a function of composition and applied stress.

Keywords

adhesionfilmsolution deposition

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