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Pulsed MOCVD of Cu Seed Layer using a(Hfac)Cu(3,3-Dimethyl-1-Butene) Source Plus H2Reactant

Published online by Cambridge University Press:  17 March 2011

Jaebum Park,
Heejung Yang and
Jaegab Lee
Jaebum Park
Affiliation:
School of Advanced Materials Engineering, Kookmin University, Seoul 136-702, Korea
Heejung Yang
Affiliation:
School of Advanced Materials Engineering, Kookmin University, Seoul 136-702, Korea
Jaegab Lee
Affiliation:
School of Advanced Materials Engineering, Kookmin University, Seoul 136-702, Korea, E-mail:, lgab@kookmin.ac.kr
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Abstract

Pulsed metalorganic chemical vapor deposition (MOCVD) of conformal copperseed layers, for the electrodeposition Cu films, has been achieved by analternating supply of a Cu(I) source and H2 reactant at thedeposition temperatures of 50 - 100°C. The Cu thickness increasedproportionally to the number of cycle, and the growth rate was in the rangeof 3.5 to 8.2 A /cycle, showing the ability to control the nano-scalethickness. As-deposited films show highly smooth surfaces even for more than100nm. In addition, about a 90% step coverage was obtained inside trenches,with an aspect ratio greater than 30:1. H2, introduced as areactant gas, can play an active role in achieving highly conformalcoatings, with increased grain sizes.

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