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Rapid Thermal Process Integration

Published online by Cambridge University Press:  25 February 2011

I.D. Calder  and
A.A. Naem
I.D. Calder
Affiliation:
Advanced Processing Techniques, Northern Telecom Electronics, P.O. Box 3511, Station C, Ottawa, Ontario, Canada, K1Y 4H7
A.A. Naem
Affiliation:
Advanced Processing Techniques, Northern Telecom Electronics, P.O. Box 3511, Station C, Ottawa, Ontario, Canada, K1Y 4H7
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Abstract

A manufacturable process must be designed with device integrity and reliability in mind. The optimum cumulative thermal budget should be chosen to achieve a shallow junction (for performance optimization) while minimizing junction leakage. At the same time the processing must satisfy reliability requirements such as good metal step coverage and oxide integrity. Interactions between thermal processes create problems such as repeated anneals, chemical reactions, pattern shifts, and non-equilibrium conditions, as well as opportunities for process simplification, such as greater flexibility in anneal and silicidation processes. In general RTP integration requires a redesign of the complete process sequence.

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