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Recent Advances in Laser-Enhanced Plating

Published online by Cambridge University Press:  21 February 2011

R. J. Von Gutfeld,
M. H. Gelchinski,
D. R. Vigliotti and
L. T. Romankiw
R. J. Von Gutfeld
Affiliation:
IBM Research Center, P.O. Box 218, Yorktown Heights, NY 10598
M. H. Gelchinski
Affiliation:
IBM Research Center, P.O. Box 218, Yorktown Heights, NY 10598
D. R. Vigliotti
Affiliation:
IBM Research Center, P.O. Box 218, Yorktown Heights, NY 10598
L. T. Romankiw
Affiliation:
IBM Research Center, P.O. Box 218, Yorktown Heights, NY 10598
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Abstract

A summary of the recent work on laser-enhanced gold plating is presented. The purpose of the study has been to obtain rapid maskless plating on thick metal samples. Results will be described on the plating rates for a variety of laser and electrical parameters. The most recent work on a laser-jet plating system will be discussed. With this system, rates of up to 30 μm/s have been achieved on 8 mil thick Be-Cu samples.

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References

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