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RF SOP (System On Package) Using Passive Embedded Substrate

Published online by Cambridge University Press:  01 February 2011

NamKee Kang,
Junchul Kim,
Dongsu Kim,
ChanSei Yoo,
JongIn Ryu and
Hyunmin Cho
NamKee Kang
Affiliation:
kangnk@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of, 82-31-789-7210, 82-31-789-7209
Junchul Kim
Affiliation:
kimjc@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
Dongsu Kim
Affiliation:
kimds@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
ChanSei Yoo
Affiliation:
ychs@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
JongIn Ryu
Affiliation:
aceryu@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
Hyunmin Cho
Affiliation:
chomin@keti.re.kr, KOREA ELECTRONIC TECHNOLOGY INSTITUTE, ELECTRONIC MATERIALS & DEVICE PACKAGING RESEARCH CENTER, # 68 Yatap-dong, Bundang-gu, Seongnamsi, Gyeonggi-do, 463-816, Korea, Republic of
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Abstract

The convergence paradigm of today, which can be characterized as multi function and high effectiveness, strongly requires an integration of RF/analog function and high-speed digital function into a single IC or package. System on Package (SOP) is a promising technology for system integration in order to meet these current trends and requirements. A passive embedded substrate is one of the most critical issues to achieve small-size and high-functional devices and modules with high integration density and deign flexibility for wireless communications.

This paper will describe integration approach for passive embedded substrate for RF applications. With the several examples such as multi-band front end module and passive/active integrated modules, the advantages of the integration using passive embedded substrates will be described with some design considerations.

Keywords

pastesimulationpackaging

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References

REFERENCES

[1] Lee, C. -H., Sutono, A., Han, S., Lim, K., Pinel, S., Tentzeris, E. M., and Laskar, J., “A compact LTCC-based Ku-band transmitter module,” IEEE Trans. Microwave Theory Tech., vol. 25, pp. 374–384, Aug. 2003.Google Scholar
[2] Heo, D., Sutono, A., Chen, E., Suh, Y., and Laskar, J., “A 1.9-GHz DECT CMOS power amplifier with fully integrated multilayer LTCC passives,” IEEE Microwae and Wireless Comp. Lett., vol. 11, pp. 249–251, June 2001.Google Scholar
[3] Kim, E., Lee, Y. S., Yoo, C. S., Lee, W. S., and Park, J. C., “A power amplifier module with fully embedded passive components in a LTCC substrate for K-PCS band mobile phone,” in Proceedings of the 23rd European Microwave Conf., vol. 1, pp. 253–256, 2003.Google Scholar
[4] Piatnitsa, V., Jakku, E., and Leppaevuori, S., “Design of a 2-pole LTCC filter for wireless communications,” IEEE Trans. Wireless Comm., vol. 3, pp. 379–381, Mar. 2004.Google Scholar
[5] Kim, J. C., Kim, D., Cho, H. M., Park, J. C., and Kang, N. K., “An LTCC based filter and front end module using heterogeneous dielectrics,” Journal of Microelectronics and Electronic Packaging, Vol. 3, No.3, 3rd Qtr., 2006, pp.129–135 Google Scholar
[6] Kim, D., Cho, H. M., Ryu, J.I., Kim, J. C., Park, J. C., and Kang, N. K., “A front end module for CDMA based on zero shrinkage of LTCC, in Proceedings of the 2006 Asian-Pacific Microwave Conf., pp. 385–388, 2006 Google Scholar