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Selective Electroless Metallization of Patterned Ligand Surfaces

Published online by Cambridge University Press:  25 February 2011

W. J. Dressick,
C. S. Dulcey,
J. M. Calvert,
J. H. Georger Jr,
G. S. Calabrese,
M. E. Thomas and
H. A. Stever
W. J. Dressick
Affiliation:
Code 6090, Naval Research Laboratory, Washington, DC 20375
C. S. Dulcey
Affiliation:
Code 6090, Naval Research Laboratory, Washington, DC 20375
J. M. Calvert
Affiliation:
Code 6090, Naval Research Laboratory, Washington, DC 20375
J. H. Georger Jr
Affiliation:
Geo-Centers, Inc., Fort Washington, MD 20744Shipley Co., Marlborough, MA 01752
G. S. Calabrese
Affiliation:
Shipley Co., Marlborough, MA 01752
M. E. Thomas
Affiliation:
National Semiconductor Co., Inc., Santa Clara, CA 95052
H. A. Stever
Affiliation:
National Semiconductor Co., Inc., Santa Clara, CA 95052
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Abstract

A process for creating patterns of metal-binding ligands on a variety of substrates is described. Deep UV patterning of chemisorbed ligand-bearing organosilane films creates modified surfaces that can selectively bind species such as Pd(II) via a covalent metal ion-ligand interaction. Patterned surface-bound Pd(II) is used to initiate additive electroless metallization at the catalytic sites. Metal adhesion to the substrate is controlled by the nature of the catalyst-ligand interaction.

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References

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