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Self-Induced Repair: a New Concept in Chemical Microprocessing

Published online by Cambridge University Press:  25 February 2011

C. Julian Chen
C. Julian Chen*
Affiliation:
IBM T. J. Watson Research Center, Yorktown Heights, NY 10598, USA
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Abstract

Self-induced repair (SIR) is a new concept in chemical microfabrication of microelectronic interconnections. It is based on local chemical processes (deposition or etching) induced by certain local electrical phenomena at defect sites (Joule heat, concentration of electrical field or current density, etc.). It has been demonstrated on four types of defects: near-opens, small opens, near-shorts, and thin shorts. The example of the SIR of near opens, or constrictions in interconnections, is discussed in detail.

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References

REFERENCES

1. Chen, C. J., Appl. Phys. Lett. 56, 2411 (1990).Google Scholar
2. Gupta, A. and Chen, C. J., Appl. Phys. Lett. 56, 2516 (1990).Google Scholar
3. Vetter, K. J., Electrochemical Kinetics, pp 15–16, (Academic Press, New York, 1967); A. J. Bard and L. R. Faulkner, Electrochemical Methods, Fundamentals and Applications, P. 49, (John Wiley & Sons, New York, 1980).Google Scholar
4. Puippe, J. Cl., Acosta, R. E. and Gutfeld, R. J. von, J. Electrochem. Soc. 128, 2539 (1981); R. J. von Gutfeld, R. E. Acusta, and L. T. Romankiw, IBM J. Res. Develop. 26, 136 (1982).Google Scholar
5. Partridge, J. P. and Chen, C. J., Customized Interconnections Generated by Laser Seeding and Self-Induced Repair, Paper D8.7, MRS 1990 –Fall Meeting, Boston, Nov. 29 (1990).Google Scholar
6. Gutfeld, R. J. von and Vigliotti, D. R., Open Circuit Repair Using Thermal Exchange Deposition of Copper, Paper D8.7, MRS 1990 Fall Meeting, Boston, Nov. 27 (1990).Google Scholar