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Solder Joining Technology

Published online by Cambridge University Press:  21 February 2011

Nick Koopman
Nick Koopman*
Affiliation:
IBM Corp., East Fishkill, N.Y., 12533
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An in-depth review of controlled collapse chip connections (c-4), or otherwise known as Flip Chip Solder Joining Technology, is present. The C4 joint utilizes solder bumps deposited on wettable terminals on the chip and a matching footprint of the substrate. The upsidedown chip (flip chip) is aligned to the substrate and all joints are made simultaneously by reflowing the solder. An in depth review of this technology is presented. Materials, design factors, fabrication processes, tools, assembly, rework, and reliability are discussed. Future trends are indicated and comparisons make with wire bonding and Tab (tape automated bonding).

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989, 431
Copyright
Copyright © Materials Research Society 1989

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