Hostname: page-component-74656f9884-g96k6 Total loading time: 0 Render date: 2026-11-10T23:15:51.589Z Has data issue: false hasContentIssue false
  • English
  • Français

Solvent and Curing Effects on Diffusion at Polyimide Interfaces

Published online by Cambridge University Press:  22 February 2011

S. F. Tead ,
E. J. Kramer ,
T. P. Russell  and
W. Volksen
S. F. Tead
Affiliation:
Cornell University, Department of Materials Science and Engineering, Bard Hall, Ithaca, NY 14853-1501
E. J. Kramer
Affiliation:
Cornell University, Department of Materials Science and Engineering, Bard Hall, Ithaca, NY 14853-1501
T. P. Russell
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120-6099
W. Volksen
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, CA 95120-6099
Get access

Abstract

Interdiffusion at interfaces between deuterated polyamic acid (d-PAA) and polyimide (PI) films was investigated with forward recoil spectrometry, an ion beam analysis technique. The PI films were prepared by spin - coating a solution of PAA on a silicon substrate, followed by an anneal at a temperature Ti, which produced partial or complete conversion of the PAA to PI. An overlayer of d-PAA was added in one set of samples by spin - coating from solution and in another set by transferring (in the absence of solvents) a dry d-PAA film onto the PI surface. The bilayer samples were then either annealed at a temperature Td or allowed to stand at room temperature. Bilayers prepared by spin - coating d-PAA from solution directly on partially cured PI films had interdiffusion distances w that decreased with increasing values of Ti to immeasurable levels by Ti = 200 °C. The decrease in w with increasing Ti is thought to be caused by a positive Flory parameter between PAA and PI which increases with the imide fraction in the PI film; the result is an increasing immiscibility between the swollen polymer layers. No interdiffusion occurred in the solventless - transfer samples for any combination of temperatures Ti or Td from room temperature up to 400 °C. Post - annealing of spin - coated bilayers at a temperature Td up to 400 °C was ineffective in producing any additional interdiffusion. Both of these results indicate that thermally activated interdiffusion (even for initially unimidized samples) does not exist in the absence of solvents, an effect attributed to the rapid increase of the glass transition temperature of the polymer with imidization.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 153: Symposium J – Interfaces Between Polymers, Metals, and Ceramics , 1989 , 239
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

1. Brown, H.R., Yang, A.C.M., Russell, T.P., Volksen, W., and Kramer, E.J., Polymer 29, 1807 (1988).Google Scholar
2. Volksen, W., and Cotts, P. M, in Polvimides: Synthesis. Characterization and Applications, edited by Mittal, K.L. (Plenum Press, New York, 1984) p. 163.Google Scholar
3. Mills, P.J., Green, P.F., Palmstrom, C.J., Mayer, J.W. and Kramer, E.J., Appl. Phys. Lett. 45, 957 (1984).Google Scholar
4. Crank, J., The Mathematics of Diffusion, 2nd. ed. (Oxford University Press, Oxford, 1975), p. 15.Google Scholar
5. Kramer, E.J., Volksen, W., and Russell, T.P. in Electronic Packaging Materials Science II, edited by Jackson, K.A., Pohanka, R.C., Uhlmann, D.R., and Ilrich, D.R. (Mater. Res. Soc. Proc. 72, Pittsburgh, PA 1986) 195.Google Scholar
6. Fryd, M., in Polyimides: Synthesis. Characterization and Applications, edited by Mittal, K.L. (Plenum Press, New York, 1984) p. 377; S.-I. Numata, K. Fujisaki and N. Kinjo, p. 259; M.I. Bessonov and N.P. Kuznetsov, p. 385.Google Scholar
7. Wrasidlo, W., J. Macromol. Sci. Phys. B6, 559 (1984).Google Scholar
8. Ferry, J.D., Viscoelastic Properties of Polymers, 3rd. ed., (Wiley and Sons, New York 1980), p. 430.Google Scholar
9. Helfand, E., and Tagami, Y., J. Polym. Sci., Part B 9, 1105 (1971).Google Scholar
10. Helfand, E., and Tagami, Y., J. Chem. Phys. 56, 3592 (1971).Google Scholar
11. Helfand, E., and Sapse, A.M., J. Chem. Phys. 62, 1327 (1975).Google Scholar
12. Binder, K. and Frisch, H.L., Macromolecules 17, 2928 (1984).Google Scholar
13. Broseta, D., Leibler, L., and Joanny, J.-F., Macromolecules 20, 1935 (1987).Google Scholar
14. Broseta, D., Leibler, L., Kaddour, L.O., and Strazielle, C., J. Chem. Phys. 87, 7248(1987).Google Scholar
15. Flory, P.J. Principles of Polymer Chemistry, (Cornell University Press, Ithaca 1953) p. 507.Google Scholar
16. Sokolov, J., Rafailovich, M.H., Jones, R., and Kramer, E.J., Appl. Phys. Lett. 54, 590 (1989).Google Scholar