Hostname: page-component-7b7567c8c-wxvwp Total loading time: 0 Render date: 2026-11-14T22:56:33.519Z Has data issue: false hasContentIssue false
  • English
  • Français

Solvent-Induced Damage in Polyimide Thin Films

Published online by Cambridge University Press:  21 February 2011

M. S. Hu
M. S. Hu*
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, CA 93106
Get access

Abstract

Solvent induced damage bands formed in residually strained polyimide thin films on different substrates have been studied. Microscopy studies have shown that these bands resemble crazes. A mechanics approach Is taken to understand the band formation phenomenon.

The critical strain for damage formation has been identified. This strain decreases with increase in exposure time, but always exhibits a threshold value. In contrast to the cracking of brittle films, the critical strain has only a weak dependence on the film thickness over a wide range. This behavior obtains because the crazing of the polyimide films is nucleation controlled. Strain-enhanced diffusion of solvent into the films is considered to be responsible for the property degradation that leads to damage formation.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989, 153
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

[1] Lee, Y.K. and Craig, J.D., Polymer Materials for Electronic Applications, (American Chemical Society, 1982), p. 107.Google Scholar
[2] Farris, R.J., Final Report on SUR IBM Contract, (1989).Google Scholar
[3] Argon, A.S. and Hannoosh, J.G., Philos. Mag., 36, p. 1195, (1977).Google Scholar
[4] Kramer, E.J., in Developments in Polymer Fracture, 1, edited by Andrews, E.H., (Applied Science Publisher, Ltd., London, 1979), Chap. 3.Google Scholar
[5] Chan, M.K.V. and Williams, J.G., Polymer, 24, p.234, (1983).Google Scholar
[6] Kambour, R.P., Encyclopaedia of Polymer Science and Technology, 4, p. 308, (1985).Google Scholar
[7] Hu, M.S. and Evans, A.G., Acta Metall., 37, p. 917, (1989).Google Scholar
[8] Shimbo, M., J. Am. Ceram. Soc., 71, p. C–424, (1988).Google Scholar
[9] Hu, M.S. and Evans, A.G., to be published.Google Scholar