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Stress- and Electromigration-Induced Voiding and Its Correlation to Macroscopic Stress Changes

Published online by Cambridge University Press:  10 February 2011

Herbert Schroeder
Herbert Schroeder*
Affiliation:
Institut für Festkörperforschung, Forschungszentrum Jüich GmbH, D-52425 Jülich, Germany; e-mail: he.schroeder@fz-juelich.de
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Abstract

This paper reviews experimental data on stress- and electromigration (EM)-induced voiding in passivated Al- and AlSiCu-lines under different experimental conditions (thermal cycling, iso-thermal annealing without and with EM-current). The data are deduced from measured changes of average metal strain or stress and from in-situ observations in a transmission electron microscope. There are excellent correlations between corresponding data sets showing stress induced voiding during cycling and isothermal annealing without EM-current, but nearly no changes in stresses or void volume during EM-testing. The implications of these results on EM-modelling are discussed.

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Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998, 237
Copyright
Copyright © Materials Research Society 1998

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