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Stress Simulation in Area Array Packaging

Published online by Cambridge University Press:  10 February 2011

Steven Groothuis,
Nick Hassanzadeh and
Les Stark
Steven Groothuis
Affiliation:
Texas Instruments, Incorporated,Mail Station 477,13532 North Central Expressway,Dallas, TX 75243, (972) 995–2268, E‐mail: nozr@msg.ti.com
Nick Hassanzadeh
Affiliation:
Texas Instruments, Incorporated,Mail Station 477,13532 North Central Expressway,Dallas, TX 75243, (972) 995–2268, E‐mail: nozr@msg.ti.com
Les Stark
Affiliation:
Texas Instruments, Incorporated,Mail Station 477,13532 North Central Expressway,Dallas, TX 75243, (972) 995–2268, E‐mail: nozr@msg.ti.com
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Abstract

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996, 283
Copyright
Copyright © Materials Research Society 1997

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References

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