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Stress-Corrosion Cracking at Ceramic-Metal Interfaces

Published online by Cambridge University Press:  15 February 2011

J. C. Card,
R. M. Cannon,
R. H. Dauskardt and
R. O. Ritchie
J. C. Card
Affiliation:
Center for Advanced Materials, Materials Sciences Division, Lawrence Berkeley Laboratory, and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720.
R. M. Cannon
Affiliation:
Center for Advanced Materials, Materials Sciences Division, Lawrence Berkeley Laboratory, and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720.
R. H. Dauskardt
Affiliation:
Center for Advanced Materials, Materials Sciences Division, Lawrence Berkeley Laboratory, and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720.
R. O. Ritchie
Affiliation:
Center for Advanced Materials, Materials Sciences Division, Lawrence Berkeley Laboratory, and Department of Materials Science and Mineral Engineering, University of California, Berkeley, CA 94720.
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Abstract

It is known that the fracture resistance of glass-copper interfaces depends strongly on the water content in ambient gaseous environments. In the present study, subcritical crack growth stimulated by water and other environmental species is investigated for such interfaces. Tests were conducted in various liquids, namely water, N-methylformamide, and n-butanol. All were found to accelerate fracture with the greatest effects from liquid water. Results are considered in the context of current models for stress-corrosion crack growth.

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