Hostname: page-component-7b7567c8c-kwt9d Total loading time: 0 Render date: 2026-11-14T22:40:22.179Z Has data issue: false hasContentIssue false
  • English
  • Français

Structural Transitions in Titanium-Aluminum Thin Film Multilayers

Published online by Cambridge University Press:  15 February 2011

Rajiv Ahuja and
Hamish L. Fraser
Rajiv Ahuja
Affiliation:
Department of Materials Science and Engineering, The Ohio State University, 116W 19th Ave, Columbus, OH 43210
Hamish L. Fraser
Affiliation:
Department of Materials Science and Engineering, The Ohio State University, 116W 19th Ave, Columbus, OH 43210
Get access

Abstract

This paper presents the results of a detailed study of titanium - aluminum thin film multilayers fabricated using UHV Magnetron sputtering. Transmission electron Microscopy (TEM) techniques have been used to characterize the structure of these multilayers and to study the various structural transitions as a function of the composition modulation wavelength (CMW). Evidence is presented which indicates the existence of a titanium based fcc structure in these films, below a critical CMW. At even smaller values of CMW, both the Ti and Al layers adopt the hep structure and are coherent with each other. The evolution of thin film microstructure has been studied using high resolution TEM (HRTEM) and an attempt is made to rationalize the stability of different phases based on the energetics of atomic stacking.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 317: Symposium B – Mechanisms of Thin Film Evolution , 1993, 479
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Article purchase

Temporarily unavailable

References

REFERENCES

1. For current reviews, see, Jin, B.Y. and Ketterson, J.B., Advances in Physics 38 (3), 189, 1989.Google Scholar
Physics, Fabrication and Applications of Multilayered Structures, ed., Dhez, P. and CWeisbuch (Plenum Press, New York, 1988).CrossRefGoogle Scholar
2. Clarke, Roy, Lemelas, F., Uher, C., Flynn, C. P. and Cunnigham, J. E., Phys. Rev. B, 34 (3), 2022, 1986. Google Scholar
3. Lamelas, F.J., Lee, C.H., He, H., Vavra, W. and Clarke, Roy, Phys. Rev. B, 40 (8), 5837, 1989.Google Scholar
4. Manuscript in preparation.Google Scholar
5. Thornton, J. A., Ann. Rev. Mater. Sci., 7, 239, 1977. Google Scholar
6. Dirks, A.G., Walters, R.A.M., deVeirman, A.E.M., Thin Solid Films, 208, 181, 1992 Google Scholar
7. Wall, M.A. and Jankowski, A.F., Thin Solid Films, 181, 313, 1989.Google Scholar
8. Jankowski, A.F. & Wall, M.A. in Structure and properties of interfaces in Materials, ed. by Clark, W.A.T., Dahmen, U. and Briant, C.L. (Mat. Res. Soc. Proc. 238, Boston, MA, 1992) pp. 297 Google Scholar
9. Redfield, A.C. and Zangwill, A. M., Phys. Rev. B., 34 (2), 1378, 1986 Google Scholar
10. Patridge, P. G., Metallurgical Reviews, p. 169, Nov 1967 Google Scholar
11. SMallman, R.E., in Modern Physical Metallurgy, 3rd ed., Butterworth and Co. Ltd, London, 1985.Google Scholar