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Structured Abrasive CMP: Length Scales, Subpads, and Planarization

Published online by Cambridge University Press:  10 February 2011

D. P. Goetz
D. P. Goetz*
Affiliation:
3M Advanced Materials Technology Center Building 201–1W-28, 3M Center, St. Paul, MN 55144–1000, dpgoetz@mmm.com
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Abstract

Chemical-Mechanical Planarization with structured abrasive uses a subpad to manage the pressure variations due to loading over a range of length scales. The effect of subpad construction on pressure responses related to those scales is illustrated.

A minimum length scale for the effect of the subpad is established via contact mechanics. Differences between one- and two-layer subpads are shown. Uniform compression, point loading, and edge exclusion are considered briefly. A model of the subpad as a plate on an elastic foundation is applied to the problem of die doming. The roles of process pressure, die size, and subpad construction are illustrated. Planarization at the intra-die, die, and wafer scales are related to the subpad construction.

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References

REFERENCES

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