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Temperature Measurement Issues in Rapid Thermal Processing

Published online by Cambridge University Press:  10 February 2011

D. P. DeWitt,
F. Y. Sorrell and
J. K. Elliott
D. P. DeWitt
Affiliation:
National Institute for Standards and Technology, Gaithersburg MD 20899, david.dewitt@nist.gov
F. Y. Sorrell
Affiliation:
Dept. of Mechanical and Aerospace Engineering, NC State University, Raleigh NC
J. K. Elliott
Affiliation:
PRIMAXX Corporation, Austin TX
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Abstract

Reliable radiometrie temperature measurement has been a major challenge in making rapid thermal processing (RTP) more widely accepted. In order to meet road map requirements involving temperature uncertainty, uniformity and control, new techniques must be demonstrated and/or existing measurement methods must be substantially improved. Critical aspects of radiometrie methods for temperature measurement are centered about the topics: radiative and optical properties of the wafers including layered systems, surface roughness effects, and reflected irradiation from lamp banks and chamber walls. The systematic method for inferring temperature is rooted in the measurement equation which relates the radiometer output to the exitent spectral radiance from the target which reaches the detector and prescribes the roles that emissivity variability and stray radiation have on the result. An overview is provided on the knowledge base for optical and thermal radiative properties. Methods for reducing emissivity and stray radiation effects are summarized. Calibration procedures necessary to assure that the in-chamber or local temperature scale is traceable to the International Temperature Scale (ITS-90) are discussed. The issues which can impact improved temperature measurement practice are summarized.

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 470: Symposium F – Rapid Thermal and Integrated Processing IV , 1997, 3
Copyright
Copyright © Materials Research Society 1997

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References

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