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TEM/STEM Sample Preparation for the Investigation of Solid State Structures: Applications to Electronic Devices and Computer Components

Published online by Cambridge University Press:  25 February 2011

Richard E. Flutie
Richard E. Flutie*
Affiliation:
Digital Equipment Corporation, Northboro, MA 01532
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Extract

There has been a resurgence of the TEM/STEM being applied to the inspection and microanalysis of solid state electronic structures and devices. As the IC industry scaled down to submicron lines and spaces the IC designer, manufacturing processor and failure analyst required better “eyes” than the SEM could give. In addition to the image improvement, the TEM/STEM provided the microanalysis capability of microelectron diffraction (<30 angstroms) and sub-micron EDXA of ultra-thinned samples.

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