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Thin Film Adhesion Study in Microelectronic Packaging

Published online by Cambridge University Press:  22 February 2011

H. S. Jeong,
Y. Z. Chu,
M. B. Freiler,
C. Durning and
R. C. White
H. S. Jeong
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
Y. Z. Chu
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
M. B. Freiler
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
C. Durning
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
R. C. White
Affiliation:
Department of Electrical Engineering and Microelectronics Sciences Laboratories, Columbia University, New York, NY 10027
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Abstract

Fracture energy (Ga) of BPDA-PDA polyimide (PI) on modified and unmodified Si surfaces was measured by the “blister” test as a function of final cure temperature. It is proven quantitatively that surface modification prior to thin film deposition enhances adhesion. Metal adhesion to PI was also measured by the same method. Reproducibility of the data was found to be exceptionally good for both cases. The linear elastic model is quite valid for the test of thin film adhesion. Therefore, it is believed that this test is best suited for Ga measurements in the study of thin film adhesion for microelectronic packaging.

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References

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