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Thin film silicon solar module encapsulation technology research

Published online by Cambridge University Press:  19 May 2015

Yu Cheng,
Huayi Hu,
Zhihong Gao,
Ke Zhou,
Xiaona Wang,
Shihong Xiang and
Xiaohui Chen
Yu Cheng
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
Huayi Hu
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
Zhihong Gao
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
Ke Zhou
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
Xiaona Wang
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
Shihong Xiang
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
Xiaohui Chen
Affiliation:
Hunan Gongchuang photovoltaic Science and Technology Co.Ltd.，Hengyang, 421005, P.R.China
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Abstract

The encapsulation failure is a serious problem which leads to power degradation and life time reduction of silicon based thin film solar module. Therefore, the encapsulation material and related technology research and development become more and more important. This article describes some different junction box and middle foil encapsulation technology of the silicon based thin film solar module, different encapsulation materials and processes are compared and their impact on the manufacturing cost and module performance are discussed. The aim of this study is to find an appropriate solution of module encapsulation failure.

Keywords

thin filmorganicpolymer

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Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1771: Symposium B/C/D/E – Recent Advances in Photovoltaics , 2015, pp. 87 - 95
Copyright
Copyright © Materials Research Society 2015 

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