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A Three Dimensional Self-folding Package (SFP) for Electronics

Published online by Cambridge University Press:  01 February 2011

David Gracias,
Jeong-Hyun Cho and
Steve Hu
David Gracias
Affiliation:
itrustyou@gmail.com
Jeong-Hyun Cho
Affiliation:
shu15@jhu.edu, Johns Hopkins University, Chemical and Biomolecular Engineering, 3400 N Charles Street, 125 Maryland Hall, Baltimore, Maryland, 21218, United States, 410-516-5284, 410-516-5510
Steve Hu
Affiliation:
dgracias@jhu.edu, Johns Hopkins University, Chemical and Biomolecular Engineering, 3400 N Charles Street, 125 Maryland Hall, Baltimore, Maryland, 21218, United States, 410-516-5284, 410-516-5510
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Abstract

We describe the concept of a 3D self-folding package (SFP) for sensors and electronic devices. The strategy is based on a self-assembly strategy wherein 2D panels interconnected with hinges spontaneously fold-up when they are released from the substrate; self-folding can be triggered by temperature or selected chemicals. The strategy enables packaging of devices in porous polyhedral geometries that can either be untethered or substrate-bound. Self-folding can enable packaging of devices in small 3D form factors and may enable efficient cooling due to porosity. The utilization of this self-folding platform to enable 3D packaging of cantilever sensors and magnetic field sensitive strain gauges is summarized.

Keywords

microelectronicspackagingmicroelectro-mechanical (MEMS)

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