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Three-DimensionalWafer Process Model for Nanotopography

Published online by Cambridge University Press:  01 February 2011

Takafumi Yoshida
Takafumi Yoshida*
Affiliation:
YNT-jp.Com 2-10-17 Asae, Hikari, Yamaguchi 743-0021, Japan
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Abstract

This paper proposes a three-dimensional wafer process model for nanotopography. This model allows us to predict the effect and behavior of nanotopography on the wafer processes especially for the wafer Mechanical/Chemical Lapping (MLP/CLP), wafer Single/Double Side Polishing (SSP/DSP) and device Chemical Mechanical Polishing (CMP).

Information

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003, F1.1
Copyright
Copyright © Materials Research Society 2003

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